MEMS gyro-chip AIST-120

AIST-120 is a silicon gyrochip made entirely out of silicon with several silicon layers. The oscillating structure (middle layer) inside the chip is naturally vacuumed since the wafer bonding is performed in a deep vacuum environment. The wafer-to-wafer bonding is a proven and reliable process that guarantees long-term stable vacuuming inside the bonded volume. The lower base layer is made using unique and state-of-the-art TSI^TM technology allowing to have feed-throughs to the oscillating structure from the outside.

Gyro-chip dimensions are 13 x 6 x 2 mm. The chip is manufactured on one of the World leading MEMS foundries – Silex Microsystems AB, that provides manufacturing capacity, advanced process technologies and proven standard process platforms to a wide range of high-tech companies.

Few statistics for the gyrochip manufacturing:

• DRIE precision: 1mkm
• High yield (>95%)
• Design adopted for high-volume production (wafer-to-wafer assembly)

Gyro-chip AIST-120 is a core technology that is available as a product in 2 units: AIST-330G (3-axis gyrometer) and AIST-330 (6 DOF IMU)